In the present research we optimize the design of light emitting diode module, produced using «chip-on-board» (COB) technology to reduce light energy losses in elements of module. Optimization was performed using numerical simulation and experimental research of COB samples. The influence of the encapsulating cover shape, reflecting substrate type, as well as the number, size and location chips were investigated. The optimal combination of the reflecting substrate type and the encapsulating cover shape allowing to maximize light output was identified. The work demonstrated the possibility of numerical simulations to optimize the design of LED modules without making expensive experimental samples.
42.79.Wc Optical coatings
42.15.Eq Optical system design
42.15.Dp Wave fronts and ray tracing
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